Rugged VPX Systems & Complete System Integration
MIL-STD-qualified VPX ATR enclosures with complete system integration and engineering services from 1 to 8 payload slots — all SOSA™ aligned, Blade-Jet® cooled, MIL-STD-461G/810H compliant for the harshest operational environments.
CU41
Flagship ½ ATR rugged VPX enclosure with four payload slots and one VITA 62 power supply slot. Designed for high-performance C5ISR and mission computing applications in airborne and ground platforms.
- 4× 3U VPX payload slots
- 1× VITA 62 PSU slot
- Blade-Jet® directed airflow cooling
- High-speed backplane up to 112 Gbps PAM4
- Front I/O options
- Support SSD drive | CU-3F28 hold-up | Extra Blade-Jet®
CU41S
SAVE ½ ATR rugged VPX enclosure optimized for rotary-wing and UAV deployments requiring rear expansion panel flexibility and higher per-slot power dissipation.
- 4× 3U VPX payload slots
- 1× VITA 62 PSU slot
- Front and rear I/O options
- 150W per slot @ 55°C
- High-efficiency Blade-Jet® cooling
- ARINC 404 SAVE compliant structure
CU21
Ultra-compact rugged 3U VPX enclosure for SWaP-optimized deployments requiring high compute density in constrained platforms.
- 2× 3U VPX payload slots
- 1× VITA 62 PSU slot or integrated Power Supply
- Compact ATR footprint
- Directed airflow thermal management
- Optimized for SWaP environments
- High-speed VPX fabric support
CU82
High-density full ATR VPX enclosure supporting eight payload slots and dual redundant VITA 62 power supplies. Built for high-performance mission computing and electronic warfare systems.
- 8× 3U VPX payload slots
- 2× VITA 62 PSU slots
- Redundant power architecture
- High-density VPX fabric
- Blade-Jet® cooling architecture
- Highly configurable
CU1
High-performance single-slot 6U VPX processor enclosure featuring integrated 350W power supply and conduction cooling. Optimized for radar signal processing, sensor fusion, and AI-accelerated compute applications requiring compact, thermally efficient deployment.
- Single 6U VPX slot for high-performance processors
- Integrated 350W power supply
- Conduction cooling with heat spreaders and heat pipes
- High-speed SERDES interconnect (112-224 Gbps PAM4)
- No backplane - direct interconnect architecture
- Optimized for thermally constrained environments